Film PKS-171

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Film adhesive PKS-171 is a film adhesive produced from a casting solution consisting of an alcohol-water solution of polyamide resin, adhesive, epoxy resin and other components.
Film PKS-171 has universal adhesive properties: adheres to non-ferrous metals, electrical steels, fiberglass, carbon plastics, polyamide films and other materials. It combines high mechanical strength with heat resistance, erosion resistance, good dielectric properties and radiation resistance. Operating temperature range: -60°C to +150°C, short-term up to +200°C.

Category: Film Adhesives

Purpose: Space engineering

Purpose: Aerospace industry

Purpose: Electronics

Technical Specifications
Main purpose and application

Technical Specifications

1. Appearance:
Homogeneous mass of viscous-flow consistency without foreign inclusions or clots.
2. Pot life, h, not less than:
  • at temperature from 0ºC to 5ºC - 30
  • at temperature from 15ºC to 20ºC - 2.5
  • at temperature from 21ºC to 25ºC - 2.0
  • at temperature from 26ºC to 27ºC - 1.5
  • at temperature from 28ºC to 35ºC - 1.0
3. Shear strength of adhesive joints from D16AT alloy, anodized in chromic acid or sanded/sandblasted, MPa (kgf/cm²), not less than:
at (23±2) ºC - 13.7 (140)
at (80±2) ºC - 5.4 (55)
at (125±5) ºC - 4.4 (45)

Main purpose and application

PKS-171 film is intended for use as an electrical insulating material in the manufacture of wound products by self-impregnation, as well as for film adhesives in the manufacture of structural products and erosion-resistant coatings.
The main areas of application of PKS-171 film are radio, electrical, and electronic industries, mechanical engineering, and instrumentation, as well as in various fields of new technology.

Main application areas:
Aviation and space:
  • Manufacture of wound products by self-impregnation.
  • Bonding honeycomb fillers and structural elements.
Electrical engineering:
  • Production of electrical insulating materials.
  • Erosion protection in high-voltage devices.
Mechanical engineering:
  • Bonding dissimilar materials (metal + composite).